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In this detailed blog post, we will provide you a simple trick with a step by step points for you to Download and Install InstaCode Live for PC Windows 10/8/7.
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If you ever wanted to try the InstaCode Live App on your PC or Laptop, you are in the correct place.
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But it is currently available only for the Android Platform.
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The program can also be used to expand previously imaged regions, acquire data under different imaging conditions, or re-image after additional tissue treatments.InstaCode Live PC is one of the best App in Tools with good reach to the users. Using WaferMapper, it is possible to map thousands of tissue sections at low resolution and target multiple points of interest for high resolution imaging based on anatomical landmarks. This automated method selects and directs imaging of corresponding regions within each section of an ultrathin section library (UTSL) that may contain many thousands of sections.
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We therefore developed WaferMapper, a software package that takes a multi-resolution approach to mapping and imaging select regions within a library of ultrathin sections. However, even high throughput image acquisition strategies generate images far more slowly (at present ~1 terabyte per day). The automated tape-collecting ultramicrotome (ATUM) makes it possible to collect large numbers of ultrathin sections quickly-the equivalent of a petabyte of high resolution images each day. Also special dicing programs are required to produce chip-free dies without resorting to laser saws. Newer, stronger and narrower blades are allowing dice with high aspect ratios to be sawn without chipping yield loss. 100% yield for singulation resulting in higher strength devices can be obtained using properly selected blades with the correct dicing parameters. This paper will present comparative yield results of various dicing setups to find the process with the best yield on singulated dice. Even the use of step cut which in most cases would alleviate chipping, but for such high aspect ratio dice, the yield improved to only 50%. With standard dicing parameters with standard blades, the singulation yield would be as low as zero. The aspect ratios of 10:1 will be compared with lower as well as high aspect ratios for dicing quality and die integrity.
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For this paper, we have emulated a medical device using blank silicon wafers cut to >3.60 mm long 0.36 mm wide and 0.100 mm thick. Insertable medical products require that dice have unusually high aspect ratios in order to fit into tubular shaped instruments. For medical devices, this is particularly a problem because medical devices must be specially shaped and assembled so that they can fit into small implantable or insertable units for the human body. So much torque and force is applied to the silicon during this process that if precautionary steps are not taken, the freed die may exhibit low strength due to chipping damage. Singulation can be the most damaging step in electronic manufacturing where individual dice are freed from a brittle silicon wafer.